Void

Underfloor Heating
Click on the features below and see the highlighted area on the system image
01

Plasterboard

02

Structural flooring

03

17mm UFH pipe

04

Cliprail

05

Rigid insulation board

06

Damp proof membrane (if required)

07

Timber battens

08

Concrete/timber subfloor

product layers product layer 1product layer 2product layer 3product layer 4product layer 5product layer 6product layer 7product layer 8
01

Plasterboard

02

Structural flooring

03

17mm UFH pipe

04

Cliprail

05

Rigid insulation board

06

Damp proof membrane (if required)

07

Timber battens

08

Concrete/timber subfloor

System benefits

product benefit

Alike other UFH systems, heat distribution is vital. However our suspended systems push the limits of a level output by, providing a void above the tray.

product benefit

Due to the lack of screed, UKAS Plates are significantly lighter than wet construction systems.

product benefit

Pre-configured, insulated panels that include all the systems components already integrated.

System description

This is a a variant of the Clip system which relies on the heating of the air void to heat the space above it. the actual output of the system may be limited in some circumstances. Insulation is laid between the battens (25mm minimum) and cliprail sections are laid across the width of the void. Pipework is then run up and down the voids, clipping into the cliprail to keep it consistent. This is a low-cost solution and is ideal in new-build situations where the insulation level is exceptional.

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